Standard IEC standard · IEC 60249-2-19:1992

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Status: Withdrawn

· Replaced by: IEC 61249-2-4:2001 , IEC 61249-2-7:2002 , IEC 61249-2-18:2002 , IEC 61249-2-19:2001 , IEC 61249-2-21:2003 , IEC 61249-2-5:2003 , IEC 61249-2-6:2003 , IEC 61249-2-11:2003 , IEC 61249-2-2:2005 , IEC 61249-2-1:2005 , IEC 61249-2-22:2005 , IEC 61249-2-23:2005 , IEC 61249-2-26:2005 , IEC 61249-2-8:2003 , IEC 61249-2-9:2003 , IEC 61249-2-10:2003 , IEC 61249-2-12:1999 , IEC 61249-2-13:1999 Amended by: IEC 60249-2-19:1992/AMD1:1993 , IEC 60249-2-19:1992/AMD2:1994
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Standard IEC standard · IEC 60249-2-19:1992

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Price: 1 760 SEK
standard ikon

Paper

Scope
Gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification

Subjects

Printed circuits and boards (31.180)


Buy this standard

Standard IEC standard · IEC 60249-2-19:1992

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Price: 1 760 SEK
standard ikon

Paper

Product information