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Standard IEC standard · IEC 61249-2-10:2003

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Status: Valid

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Standard IEC standard · IEC 61249-2-10:2003

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
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Scope
Gives requirements for properties of cyanate ester, brominated epoxide modified or unmodified woven E-glass laminate sheets of defined flammability, copper-clad, in thicknesses of 0,05 mm to 3,2 mm. The flammability rating is achieved through the use of brominated fire retardants contained as an integral part of the epoxide polymeric structure.

Subjects

Printed circuits and boards (31.180)

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Standard IEC standard · IEC 61249-2-10:2003

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
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Price: 1 950 SEK
standard ikon pdf

PDF

Price: 1 950 SEK
standard ikon

Paper

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Product information

Language: English French

Written by: IEC

International title:

Article no: STD-562832

Edition: 1

Approved: 2/27/2003

No of pages: 45

Replaces: IEC 60249-2-6:1985/AMD4:2000 , IEC 60249-2-9:1987/AMD5:2000 , IEC 60249-2-10:1987/AMD5:2000 , IEC 60249-2-14:1988/AMD5:2000 , IEC 60249-2-18:1992/AMD3:2000 , IEC 60249-2-16:1992/AMD3:2000 , IEC 60249-2-17:1992/AMD3:2000 , IEC 60249-2-13:1987/AMD1:1993 , IEC 60249-2-14:1988 , IEC 60249-2-7:1987 , IEC 60249-2-8:1987 , IEC 60249-2-8:1987/AMD1:1993 , IEC 60249-2-1:1985/AMD4:2000 , IEC 60249-2-2:1985/AMD5:2000 , IEC 60249-2-3:1987/AMD4:2000 , IEC 60249-1:1982 , IEC 60249-1:1982/AMD4:1993 , IEC 60249-2-1:1985 , IEC 60249-2-10:1987 , IEC 60249-2-13:1987 , IEC 60249-2-15:1987 , IEC 60249-2-15:1987/AMD1:1993 , IEC 60249-2-16:1992 , IEC 60249-2-17:1992 , IEC 60249-2-18:1992 , IEC 60249-2-19:1992 , IEC 60249-2-19:1992/AMD1:1993 , IEC 60249-2-19:1992/AMD2:1994 , IEC 60249-2-2:1985 , IEC 60249-2-3:1987 , IEC 60249-2-6:1985 , IEC 60249-2-9:1987 , IEC 60249-3-1:1981 , IEC 60249-3-3:1991 , IEC 60249-2-7:1987/AMD4:2000