Standard IEC standard · IEC 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Status: Valid

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Standard IEC standard · IEC 60749-14:2003

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Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Subjects

General (31.080.01)

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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

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