Standard IEC standard · IEC 60749-15:2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Status: Withdrawn

· Replaced by: IEC 60749-15:2010

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Standard IEC standard · IEC 60749-15:2003

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Scope

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

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General (31.080.01)

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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

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