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Standard IEC standard · IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Status: Valid

· Amended by: IEC 60749-19:2003/AMD1:2010
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Standard IEC standard · IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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Scope
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

Subjects

General (31.080.01)

Buy this standard

Standard IEC standard · IEC 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
Subscribe on standards - Read more Dölj
Price: 720 SEK
standard ikon pdf

PDF

Price: 720 SEK
standard ikon

Paper

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Product information

Language: English French

Written by: IEC

International title:

Article no: STD-562801

Edition: 1

Approved: 2/13/2003

No of pages: 11

Replaces: IEC 60749:1996/AMD2:2001 , IEC 60749:1996/AMD1:2000 , IEC 60749:1996