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Standard IEC standard · IEC 60749-20 Cor 1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Status: Withdrawn

· Replaced by: IEC 60749-20:2008
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Standard IEC standard · IEC 60749-20 Cor 1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Price: 0 SEK
standard ikon

Paper

Scope
Modification of the validity date: now put at 2007.

Subjects

General (31.080.01)

Buy this standard

Standard IEC standard · IEC 60749-20 Cor 1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Price: 0 SEK
standard ikon

Paper

Product information

Language: English French

Written by: IEC

International title:

Article no: STD-569697

Edition: 1

Approved: 8/13/2003

No of pages: 0

Correction: IEC 60749-20:2002

Replaced by: IEC 60749-20:2008