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Standard IEC standard · IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Status: Valid

· Corrected by: IEC 60749-22:2002/COR1:2003
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Standard IEC standard · IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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Scope
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.

The contents of the corrigendum of August 2003 have been included in this copy.

Subjects

General (31.080.01)

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Standard IEC standard · IEC 60749-22:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
Subscribe on standards - Read more Dölj
Price: 1 950 SEK
standard ikon pdf

PDF

Price: 1 950 SEK
standard ikon

Paper

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Product information

Language: English French

Written by: IEC

International title:

Article no: STD-559981

Edition: 1

Approved: 9/12/2002

No of pages: 41

Replaces: IEC 60749:1996/AMD2:2001 , IEC 60749:1996/AMD1:2000 , IEC 60749:1996