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Standard IEC standard · IEC 60749-32:2002

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Status: Valid

· Corrected by: IEC 60749-32:2002/COR1:2003 Amended by: IEC 60749-32:2002/AMD1:2010
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Standard IEC standard · IEC 60749-32:2002

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
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Scope
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device.

The contents of the corrigendum of August 2003 have been included in this copy.

Subjects

General (31.080.01)

Buy this standard

Standard IEC standard · IEC 60749-32:2002

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
Subscribe on standards - Read more Dölj
Price: 720 SEK
standard ikon pdf

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Price: 720 SEK
standard ikon

Paper

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Product information

Language: English French

Written by: IEC

International title:

Article no: STD-559955

Edition: 1

Approved: 8/30/2002

No of pages: 9

Replaces: IEC 60749:1996/AMD2:2001 , IEC 60749:1996/AMD1:2000 , IEC 60749:1996